PRODUCT INTRODUCTION
Ultra-fine Silica Powder (Semiconductor Encapsulation) is a high-purity functional filler specially developed for semiconductor packaging and electronic applications. It is produced from high-quality quartz through crushing, grinding, classification, purification and surface modification, with strict control over particle size distribution, sphericity, purity and alpha radioactivity.
This product is mainly used as filler in epoxy molding compounds, underfill materials, encapsulants and electronic composite materials. It helps reduce thermal expansion coefficient, improve thermal conductivity, enhance electrical insulation, lower molding shrinkage and increase mechanical strength of semiconductor packaging materials. Its spherical particle shape also improves flowability and reduces wear on molds and processing equipment.
Our ultra-fine silica powder is manufactured in a controlled clean production environment. It is available in different grades according to D50 particle size, sphericity, purity, alpha radioactivity, surface treatment and semiconductor encapsulation requirements. Each batch is inspected for particle size, specific surface area, purity, alpha radioactivity, moisture and dispersion performance before shipment.
We provide complete export documents including COA, TDS and SDS for quality traceability and customs compliance. Our technical team can recommend the most suitable grade and formulation according to your epoxy system, packaging process, device level and destination country regulations.
POINTS FOR ATTENTION
ORDER INSTRUCTIONS
1. Confirm Application and Packaging Requirements
Please inform us of your application field, downstream product, epoxy system, packaging process, particle size requirement and alpha radioactivity target. We will recommend the most suitable ultra-fine silica powder grade.
2. Trial Sample and Laboratory Evaluation
We can provide trial samples for formulation test, dispersion evaluation and reliability verification. Customers may test particle size, sphericity, flowability, dielectric property and compatibility with their epoxy system. Sample COA and SDS will be attached.
3. Confirm Packaging, Quantity and Export Terms
Standard packing: 25kg bag / carton, 50kg bag, IBC jumbo bag. Custom shipping marks and pallet reinforcement available. Quotation under FOB / CIF / DDP is acceptable. Standard export data: HS Code 3824.9999, non-hazardous. Required customs documents: commercial invoice, packing list, bill of lading, certificate of origin, COA and SDS.
4. Delivery and After-sales Technical Support
Each batch is supplied with COA, TDS and SDS. Our technical team supports grade selection, dosage adjustment, dispersion optimization and process guidance, and assists with import declaration information for destination ports.
Trial Order Tip:
For new customers, we recommend a small trial batch first to verify ultra-fine silica powder performance in your actual packaging system and pre-review export documents before bulk order.
For new customers, we recommend a small trial batch first to verify ultra-fine silica powder performance in your actual packaging system and pre-review export documents before bulk order.
USAGE NOTES
Dosage Control:
The recommended dosage varies by application, typically from 30% to 90%. Start from lower dosage and adjust according to formulation test and packaging result.
The recommended dosage varies by application, typically from 30% to 90%. Start from lower dosage and adjust according to formulation test and packaging result.
Dispersion Operation:
Add ultra-fine silica powder gradually into the epoxy matrix under stirring or extrusion. Control dispersion time and shear intensity to avoid particle agglomeration.
Add ultra-fine silica powder gradually into the epoxy matrix under stirring or extrusion. Control dispersion time and shear intensity to avoid particle agglomeration.
Compatibility Check:
Before mass production, test compatibility with epoxy resin, curing agent, coupling agent and other additives. Observe viscosity change, dispersion stability and package reliability.
Before mass production, test compatibility with epoxy resin, curing agent, coupling agent and other additives. Observe viscosity change, dispersion stability and package reliability.
Process Condition Consideration:
Adjust grade and dosage according to particle size distribution, processing temperature, moisture and package specification. Fine grades usually require more careful dispersion.
Adjust grade and dosage according to particle size distribution, processing temperature, moisture and package specification. Fine grades usually require more careful dispersion.
Storage & Sea Freight Guidance:
Keep sealed in a dry, cool and ventilated warehouse. Avoid moisture, rain and direct sunlight. It is non-dangerous goods for shipping.
Keep sealed in a dry, cool and ventilated warehouse. Avoid moisture, rain and direct sunlight. It is non-dangerous goods for shipping.
Safety Operation:
Wear dust mask, gloves and goggles during handling. Avoid inhaling dust. If splashed into eyes, rinse with plenty of clean water immediately.
Wear dust mask, gloves and goggles during handling. Avoid inhaling dust. If splashed into eyes, rinse with plenty of clean water immediately.
COMMON FORMULAS
| Application Type | Main System Components | Recommended Grade |
|---|---|---|
| Semiconductor Encapsulation | Epoxy resin, curing agent, filler, ultra-fine silica powder | US-100 / US-300 |
| Underfill Material | Underfill epoxy, curing agent, ultra-fine silica powder | US-200 |
| High Reliability Package | High purity epoxy, low alpha filler, ultra-fine silica powder | US-300 |
| Thin Wall Encapsulation | Epoxy resin, high flow filler, ultra-fine silica powder | US-400 |
| Thermal Composite | Epoxy resin, thermal conductive filler, ultra-fine silica powder | US-500 |
| CCL & PCB Substrate | Resin, glass cloth, filler, ultra-fine silica powder | US-600 |
| Precision Ceramic | Ceramic matrix, sintering aid, ultra-fine silica powder | US-100 |
| Custom Formulation | Customer packaging system and reliability target | Custom Ultra-fine Silica Powder |
Formula Guidance:
Use US-100 for standard encapsulation, US-200 for underfill, US-300 for high reliability, US-400 for thin wall encapsulation, US-500 for thermal composites and US-600 for CCL/PCB. The dosage should be confirmed by formulation test and package reliability inspection.
Use US-100 for standard encapsulation, US-200 for underfill, US-300 for high reliability, US-400 for thin wall encapsulation, US-500 for thermal composites and US-600 for CCL/PCB. The dosage should be confirmed by formulation test and package reliability inspection.
COMMON PROBLEMS IN DOWNSTREAM PRODUCTION
High Viscosity and Poor Flowability
Fine particle size, high surface area or excessive dosage increases epoxy viscosity.
Solution: Reduce dosage, select coarser grade and optimize dispersion condition.
Poor Dispersion and Agglomeration
Insufficient surface treatment, low shear force or unsuitable particle size causes agglomerates.
Solution: Use surface-treated grade, increase dispersion time and optimize extrusion condition.
High Thermal Expansion Coefficient
Low filler content, wrong particle size or unsuitable grade increases package stress.
Solution: Increase filler content, use spherical grade and optimize particle packing.
Low Thermal Conductivity
Unsuitable grade, poor dispersion or low filler content reduces heat dissipation.
Solution: Select thermal composite grade, improve dispersion and optimize formulation.
Package Reliability Issue
Impurities, wrong alpha level or poor interface bonding causes reliability risk.
Solution: Use high purity low alpha grade, test compatibility and improve interface bonding.
Mold Wear Increase
Irregular particles or hard impurities accelerate mold wear during encapsulation.
Solution: Select spherical grade, control impurity and improve particle shape.
Customs Detention Due to Mismatched Documents
Incorrect HS code or SDS information triggers inspection and detention at destination ports.
Solution: Confirm destination country regulations before order. Standard export data: HS Code 3824.9999, non-hazardous. We supply consistent full-set SDS / COA documents.
Batch Performance Variation
Changes in particle size, purity or surface treatment cause inconsistent results.
Solution: Standardize production process, inspect particle size and purity per batch, and stabilize surface treatment quality.
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FAQ
PRICE INFORMATION
- Quotation Basis: CMC price depends on product grade, viscosity, substitution degree, order quantity and delivery terms.
- Price Validity: All quotations are subject to market raw material fluctuation. Normally valid for 7 days unless otherwise specified.
- Price Contains: The quoted price covers product cost and standard export packaging. Freight, insurance and export charges are calculated separately according to Incoterms.
- Tax & Invoice: Commercial invoice for export will be provided. Relevant export tax formalities can be handled.
- Payment Discount: Better price can be offered for larger repeated orders. Please contact us for the latest formal quotation.
DELIVERY TIME & SHELF LIFE
- Production Lead Time: 7–15 working days after receiving your deposit, subject to factory production schedule.
- Shipping Arrangement: After production completion, we will book container and arrange shipment. Port space availability may affect the departure date.
- Transit Time: Sea transit time varies according to destination port, generally ranges from 15 to 45 days.
- Shelf Life: 24 months from production date when stored under proper dry and cool conditions with original sealed packaging.
- Storage Warning: Once the bag is opened, please consume as soon as possible and keep away from moisture, high temperature and direct sunlight.
PRODUCT QUALITY
- Raw Material Inspection: All raw materials are strictly inspected before entering production line to guarantee stable base quality.
- In-process Monitoring: Continuous online monitoring during production for viscosity, substitution degree and moisture content.
- Batch Test: Every finished batch will be sampled and tested before delivery. Qualified report will be provided together with shipment documents.
- Consistency Control: Automated production lines reduce batch difference, ensuring stable performance for repeated orders.
- Quality Support: We accept third-party inspection before shipment. Technical team offers after-sales technical support for quality related issues.
ABOUT US
- Headquartered in Shijiazhuang: Based in Shijiazhuang, Hebei, a globally influential fine chemical production hub with huge capacity and full industrial chain to ensure stable raw materials and bulk supply.
- Geographic Advantage: Convenient inland transport near Tianjin and Qingdao ports, supporting fast container shipment and competitive export logistics cost.
- Full-chain Supplier: One-stop provider of fine chemical additives and matching production equipment, custom service available beyond cellulose ethers.
- Technical Team: Professional team supplies formula consultation, sample testing and product selection for various industrial projects.
- Global Export: Years of export experience, providing reliable goods, full export documents and timely after-sales technical support.
相关产品及设备
USEFUL LINKS
- AIChE https://www.aiche.org/
- IChemE https://www.icheme.org/
- Cheresources https://www.cheresources.com/
- NIST Chemistry WebBook https://webbook.nist.gov/chemistry/
- AspenTech https://www.aspentech.com/
- DECHEMA https://www.dechema.de/en.html
- ChemEngPlanet https://www.chemengplanet.com/
- PubChem https://pubchem.ncbi.nlm.nih.gov/
- Chemical Processing https://www.chemicalprocessing.com/
- ChemIndustry https://www.chemindustry.com/
- PharmaChemEngineer https://www.pharmachemeng.com/
- GlobalSpec https://www.globalspec.com/